Microdul AG - Your trusted partner for advanced microelectronics. We master the processes at all implementation stages — from development and engineering through production and test of custom applications. We strive to delight and inspire our customers.
Hall 2 / A 2020
Microdul possesses a broad and pro-found know-how in the multi-faceted world of micro-electronics. In our business areas of semiconductors, modules and thick-film, we convert this know-how into fascinating products and services. Certifications in ISO 9001 and ISO 13485 are witnesses to our process excellence — as well as the numerous, successful customer audits. Whether you need a standard pro-duct or an individual solution — with Microdul as your partner, you will successfully cope with any hurdle.
Microdul masters the following process technologies and more:
-Miniaturisation of electronics
-Die and Wire Bonding (Al, Au), 15-350 um Wire Diameter
-Chip on Chip (COC), Chip on Ceramic, Chip on Board (COB), Chip on Flex (COB), Package on Package (POP)
-Flip chip assembly 150um pitch
-SMD mounting, 01005 Packages (0.2 x 0.4mm)
-Stud Bumping (Au) on Die and Wafer.
-Assembly on different substrates; flex rigid, thick film, thin film, Ceramic packages, direct copper bonding DCB
-Solder Ball Attach (BGA)
-Vacuum soldering (for power applications, CPV)
-Laser trimming (active/passive)
-100% Functional testing
-Failure analysis (X-Ray, X Section
-ISO 9001, ISO 13485 (quality management system for medical modules)
-ASIC Design (Low-Power, mixed Signal Arrays)
-Wafer Service, Microdul multiprojekt-wafer (MPW)
Zürich, Schweiz8045 Zürich
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